Hexaphenoxycyclotriphosphazene / Phenoxycycloposphazene CAS 1184-10-7
1184-10-7 Hexaphenyloxycyclophosphonic acid (HPCTP), a high-end halogen-free environmentally friendly flame retardant, featuring phosphorus and nitrogen synergistic efficient flame retardancy. It is mainly used in PC/PC/ABS, electronic copper-clad laminates, chip packaging, and new energy components. The addition amount is low, the thermal stability is high, and it does not affect the material properties.
Degradation temperature: > 300℃, excellent thermal stability
Density: 1.31 g/cm³
Solubility: Soluble in organic solvents such as toluene and dichloromethane, insoluble in water
Structural features: Phosphorus-nitrogen alternating six-membered heterocyclic ring, with 6 phenyl oxygen groups attached, halogen-free, low smoke, and low toxicity
| Item | Specifications |
| Appearance | White or similar white powder |
| Melting Point ℃ | 110～112 |
| Volatile matter % | ≤0.5 |
| Ash % | ≤0.05 |
| Purity % | ≥99.0 |
| Cl – mg/L | ≤20.0 |
Epoxy Resins: Used to improve fire resistance in epoxy-based composites, especially those requiring high heat resistance.
Electronic Materials: Employed in encapsulating materials for electronic components due to its flame retardant and insulating properties.
Plastics and Polymers: Incorporated into plastics like PC, PC/ABS, PPO, and nylon to enhance their fire safety.
Paints and Coatings: Used in powder coatings to improve their fire resistance.
LEDs: Used in LED luminous diodes and other LED-related applications.
Copper Clad Plates: A component in the manufacturing of these plates.
• Standard Packing: 25 kg/bag; 25 kg/drum
• MOQ: to be confirmed by grade and destination
• Lead Time: to be confirmed by order quantity and production schedule
• Shipping: sea / air / express options available
• Store in a cool, dry, and well-ventilated place.
• Keep container tightly closed and protected from moisture.
• Avoid direct sunlight, heat, and open flame.
• Follow SDS guidance for incompatible materials.
