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4,4′-Methylenebis(2,6-dimethylphenylcyanate) CAS 101657-77-6


  • CAS: 101657-77-6
  • Molecular Formula: C₁₉H₁₈N₂O₂
  • Molecular Weight: 306.36
  • Form: Powder
  • Synonyms: Cyanic acid methylenebis(2,6-dimethyl-4,1-phenylene) ester; tetramethyl bisphenol f cyanate ester; METHYLENEBIS(2,6-DIMETHYL-4,1-PHENYLENE)ESTEROFCYANICA.; CYANICACID,METHYLENEBIS(2,6-DIMETHYL-4,1-PHENYLENE)EST.
  • Product Detail

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    Product Overview

    Low viscosity, easy processing: The methyl group blocks the intermolecular forces, resulting in a low melt viscosity. 4,4′-Methylenebis(2,6-dimethylphenylcyanate) (CAS 101657-77-6) is suitable for RTM, winding, and prepreg processes.
    Low dielectric, high-frequency stability: After curing, Dk ≈ 2.9, Df < 0.001 (10GHz). The loss is extremely low at high frequencies, making it suitable for 5G/6G millimeter wave scenarios.
    High heat resistance, low moisture absorption: Tg ≈ 260–290℃, long-term service temperature 190–220℃; water absorption rate < 0.8%, and the performance retention rate in humid heat environments is high.
    Low toxicity, no BPA: A bisphenol A substitute, without endocrine disruption risks, and with higher safety.

    Specification 

    Item Specifications
    CAS 101657-77-6
    Form Powder
    Density 1.14
    Flash point 162°C

    Application

    1. High-frequency high-speed copper-clad laminate (core)
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) is used in 5G/6G base station antenna boards, millimeter-wave radar boards, and high-speed server PCBs, replacing BADCy / epoxy, significantly reducing signal loss and enhancing transmission rate.
    Representative: Hydrocarbon resin copper-clad laminate, high-frequency PTFE composite board's matrix resin.
    2. High-end electronic packaging and substrates
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) chip packaging substrate, IC carrier board, high-frequency connector, insulating spacer, suitable for lead-free high-temperature welding and long-term humid heat conditions.
    3. High-performance composite materials and coatings
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) ablative-resistant material, high-temperature insulation coating, electromagnetic shielding material; copolymerized with epoxy / BMI to balance cost and performance.

    Packaging & Shipping

    • Standard Packing: 25 kg/bag; 25 kg/drum
    • MOQ: to be confirmed by grade and destination
    • Lead Time: to be confirmed by order quantity and production schedule
    • Shipping: sea / air / express options available

    Storage & Handling

    • Store in a cool, dry, and well-ventilated place.
    • Keep container tightly closed and protected from moisture.
    • Avoid direct sunlight, heat, and open flame.
    • Follow SDS guidance for incompatible materials.


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