BPADA CAS 38103-06-9

CAS: 38103-06-9

Purity: ≥98%

Molecular Formula: C31H20O8

EINECS: 253-781-7

Synonym : 4,4'-(4,4'-Isopropylidenediphenoxy) bis (phthalic anhydride)、2,2-Bis (4-(3,4-dicarboxyphenoxy) phenyl) propanedianhydride、BPADA、Bisphenol A dianhydride、4,4'-BISPHENOL A DIANHYDRIDE、5,5'-((1-methylethylidene) bis (4,1-phenyleneoxy)) bis-3-isobenzofurandione

Leave Your Message

Product Detail

Download

Product Tags

What is BPADA CAS 38103-06-9 ?

4,4'-(4,4'-ISOPROPYLIDENEDIPHENOXY)BIS(PHTHALIC ANHYDRIDE) (BPADA) is a prepared polyetherimide monomer and a type of fusible polyimide. 4,4'-(4,4'-ISOPROPYLIDENEDIPHENOXY)BIS(PHTHALIC ANHYDRIDE) not only retains all the excellent properties of polyimide but also has the processing performance of general plastic plastics. Moreover, 4,4'-(4,4'-ISOPROPYLIDENEDIPHENOXY)BIS(PHTHALIC ANHYDRIDE) is low in price and suitable for the preparation of thin-walled products and structurally complex products.

Specification

ITEM	STANDARD
Appearance	White Powder
The main content % ≥	≥98%
Melting point	188.0 - 192.0℃
Density	1.406g/cm³

Application

1. Synthesize general-purpose high-performance polyimide (PI) products

This is the most conventional and core application of BPADA. BPADA is polycondensed with common diamine monomers such as 4,4' -diaminodiphenyl ether (ODA) to form polyimide that combines "heat resistance and easy processability". This type of PI material, due to the presence of ether bonds and isopropyl groups in its molecular structure, retains the high-temperature resistance of PI (long-term service temperature 180-220℃). BPADA is also easier to be made into films, plates, etc. than ordinary PI, and is commonly applied in:

1) Basic insulating components in the electronics field: Base film and cover film for making flexible printed circuit boards (FPC), as well as high-temperature resistant insulating paper/insulating varnish for motors and transformers, to meet the "miniaturization + temperature resistance" requirements of electronic components, such as internal insulation protection for consumer electronics and industrial motors.

2) General industrial high-temperature resistant components: Made into PI plates and tubes, they are used for high-temperature resistant brackets around automotive engines and internal heat-resistant parts of household appliances (such as ovens and microwave ovens). They can withstand temperatures above 150℃ for a long time, and are resistant to aging and cracking.

2. Modify conventional resins to enhance performance

In conventional resin modification, BPADA, as a "heat-resistant reinforcing monomer", is commonly used to optimize the performance of epoxy resins and phenolic resins and expand their application scenarios:

1) Epoxy resin modification: When compounded with common epoxy resin, BPADA enhances the high-temperature resistance of the resin (increasing the long-term temperature resistance of the cured resin from 120℃ to over 180℃), and is used for bonding the main beams of wind turbine blades and as an insulating coating for high-voltage cables, meeting the long-term usage requirements in outdoor or industrial environments.

2) Basic raw materials for high-temperature resistant coatings/adhesives: As a cross-linking component of coatings and adhesives, BPADA is compounded with phenolic resins and silicone resins to produce high-temperature resistant coatings for industrial equipment (such as anti-corrosion and heat-resistant coatings for the inner walls of boilers and pipelines), and high-temperature resistant adhesives that cure at room temperature for metals and ceramics. These are commonly used for protection and bonding of mechanical and chemical equipment.