(3-Glycidyloxypropyl)triethoxysilane CAS 2602-34-8
3- glycidyl ether oxypropyl triethoxysilane is a silane coupling agent that combines organic epoxy groups and inorganic siloxy groups. (3-Glycidyloxypropyl)triethoxysilane can build a "bridge" between organic materials and inorganic substrates, enhancing the interfacial bonding force. (3-Glycidyloxypropyl)triethoxysilane is widely used in coatings, adhesives, composite materials and other fields.
ITEM |
STANDARD |
Appearance |
Colorless and clear liquid |
Total effective content(%) |
97% |
1. Composite materials: Enhance the bonding force between inorganic fillers and resins
Core function: Improve the interfacial compatibility between glass fibers, mineral fillers (such as talcum powder, wollastonite) and resins (epoxy resin, polyurethane, polyester), significantly enhancing the mechanical properties and water resistance of composite materials.
Typical applications
Glass fiber reinforced plastic (FRP) : Treat the surface of glass fibers to prevent debonding at the interface between fibers and resin, and enhance the tensile strength and impact resistance of composite materials (such as automotive parts, wind turbine blades).
Engineering plastic modification: When adding mineral fillers to nylon and polypropylene, pre-treat the fillers with them to reduce the "floating fiber" phenomenon and enhance the rigidity and dimensional stability of the materials.
2. Coatings and Adhesives: Enhance adhesion and durability
Core function: Enhance the adhesion between the coating/adhesive layer and inorganic substrates such as metal, glass, ceramics, and concrete through chemical bonding, while also improving the resistance to moisture and heat as well as salt spray.
Typical applications
Industrial anti-corrosion coatings: used as primers for ships, Bridges and pipelines, they prevent coating bubbling and peeling, and extend the protective life.
Building sealant: Improves the adhesion of silicone sealant to stone and concrete, especially suitable for damp environments (such as bathrooms, exterior wall joints).
Electronic adhesives: Enhance the bonding force between chip packaging materials and substrates, and improve the resistance to high and low temperature cycling (such as automotive electronic components).
25kgs/drum, 9tons/20’container
25kgs/bag, 20tons/20’container

(3-Glycidyloxypropyl)triethoxysilane CAS 2602-34-8

(3-Glycidyloxypropyl)triethoxysilane CAS 2602-34-8